• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Described is a bead removal system (10) for treating a substrate (12), which comprises a bead removal head (20) with a main body (22) and two arms (24) protruding from the main body (22). The arms (24) are spaced apart from one another and define between them a receiving space (26) for accommodating a substrate (12) to be treated. The projecting arms (24) each have a functional surface (36) which face each other, and the functional surfaces (36) each have at least one fluid outlet (38). A method for treating a substrate (12) is also described.
    公开号:AT521734A2
    申请号:T50814/2019
    申请日:2019-09-24
    公开日:2020-04-15
    发明作者:
    申请人:Suss Microtec Lithography Gmbh；
    IPC主号:
    专利说明:

    The invention relates to a bead removal system for treating a substrate. The invention further relates to a method for treating a substrate.
    BACKGROUND
    The invention particularly relates to the production of microstructured components by means of photolithography. The microstructure components include an integrated surface, semiconductor chips or micro-electromechanical systems (MEMS). A substrate, which is also known as a wafer, is used for the photolithography process, the substrate being coated with a photoresist, also called a resist. The coated substrate is then exposed with a mask, the physical and / or chemical properties of the photoresist partly changing due to the exposure.
    The photoresist is usually applied to the substrate in one layer, it being important that the applied photoresist layer is free of irregularities or particles. The photoresist is therefore applied, inter alia, during a rotation of the substrate, this process being referred to as spin coating. This ensures that the applied photoresist, namely the coating, is distributed as evenly as possible on the surface of the substrate.
    The spin coating, however, results in a bulge of the photoresist material on the edge of the top of the substrate due to the rotation of the substrate during the spin coating. The centrifugal force that occurs when the substrate is rotated strictly presses the resist material applied to the substrate radially outward, so that an edge bead is formed.
    So far, the bead of the coating has been removed using a macro needle for solvent distribution, but this is inaccurate when a wafer is bent.
    In addition, the use of a solvent or a gas stream is known which is directed to the substrates in order to remove the already existing edge bead or to remove excess material of the photoresist and to prevent the formation of the bead at the edge. In other words, the solvent or gas flow is intended to prevent the appearance of a bead and / or to eliminate an existing bead.
    Known bead removal systems are used in the respective coating modules in which the resist material is applied to the substrate, so that geometric restrictions of the coating module have to be taken into account during the bead removal process. The systems and respective processes are generally highly sensitive to a change in the curvature of the substrate to be treated.
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    BRIEF SUMMARY
    Accordingly, there is a need for an edge bead removal system and a method for treating a substrate that can be used to remove an edge bead more efficiently.
    The invention provides an edge bead removal system for treating a substrate comprising an edge bead removal head having a main body and two arms protruding from the main body, the arms being spaced apart and defining a receiving space therebetween for accommodating a substrate to be treated, the arms each one Have functional surface facing each other, and the functional surfaces each have at least one fluid outlet.
    Accordingly, in the edge bead removal system, a separately formed edge bead removal head is used which is substantially C-shaped, since the edge bead removal head has a main body and two arms which protrude from the main body, in particular from the same side of the main body. The main body and the two arms thus together form the receiving space for the substrate to be treated, the receiving space for accommodating the substrate to be treated being open on only one side. Since both arms each have the functional surface with the at least one fluid outlet, a fluid flow can be directed from the respective fluid outlets to the receiving space and to the substrate accommodated in the receiving space. Accordingly, a first fluid stream can be directed to the top of the substrate, in particular to the photoresist material applied to the top of the substrate. In addition, a second fluid stream can be directed to the underside of the substrate that is not coated with the photoresist material.
    However, the second fluid stream can be directed to an edge or along the edge of the substrate to be treated, so that a negative pressure or a vacuum is generated on the upper side of the substrate. An existing edge bead or photoresist material that forms the edge bead is removed due to the negative pressure or vacuum generated. This generally corresponds to the principle of a jet pump, according to which a delivery flow is generated at the top of the substrate with the fluid flow that flows from the bottom to the top along the edge of the substrate. Strictly speaking, the generated fluid flow pulls the excess photoresist material, so that an edge bead is prevented. In other words, a bulge of the photoresist material, which generally occurs due to the spin coating at the edge of the top of the substrate, can be prevented in a simple manner by passing a suitable fluid stream, namely the second fluid stream, at the bottom of the substrate.
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    According to one aspect, the at least one fluid outlet (each functional surface) is assigned to a nozzle. The velocity of the fluid flow can thus be changed through the nozzle. The speed of the fluid flow is particularly increased. In addition, the nozzle can ensure that the fluid flow originating from the at least one fluid outlet can be guided in a simple manner.
    Strictly speaking, each functional surface can comprise a nozzle, several nozzles, an outflow slot, a so-called air lamella, a brush-like outflow unit or the like, with which, among other things, a different profile of the fluid flow is obtained. This is particularly true for non-round substrates, e.g. important for square substrates.
    According to a further aspect, the at least one fluid outlet is connected to a nitrogen line which is embedded in the bead removal head. A nitrogen stream or generally a gas stream can thus be delivered via the at least one fluid outlet (each functional surface). In other words, nitrogen is used to remove the edge bead or to prevent the presence of an edge bead, the corresponding gas stream being directed to the substrate to be treated. The fluid flow provided by the at least one fluid outlet connected to the nitrogen line can be free of solvents. This ensures that no further substances are introduced, since a chamber of the marginal bead removal system can generally be flooded with nitrogen. The bead removal head and the substrate to be treated are housed in the chamber in a specific atmosphere. Strictly speaking, the nitrogen stream is used to remove the excess resist material essentially mechanically or physically.
    The nitrogen line may generally be connected to a nitrogen source that provides the nitrogen used by the at least one fluid outlet.
    According to a further embodiment, the at least one fluid outlet is connected to a solvent line which is embedded in the bead removal head. Thus, a solvent can be used to remove the existing edge bead or to prevent the presence of an edge bead. The solvent stream can be passed directly onto the resist material for direct removal of the resist material. The excess resist material is essentially chemically removed. The solvent can be acetone or another suitable solvent for the respective photoresist material.
    The solvent line may generally be connected to a solvent source that provides the solvent used by the at least one fluid outlet.
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    According to one embodiment, each functional surface has at least two fluid outlets. The at least two fluid outlets can thus be connected to the nitrogen line and to the solvent line, so that both fluid flows can generally be used to remove the bead. Strictly speaking, the user of the edge bead removal system can select the respective fluid for removing the edge bead. In addition, a control unit of the bead removal system can automatically control the nitrogen source or the solvent source.
    Since each functional surface of the bead removal head can be connected to a solvent line or a nitrogen line, a solvent stream and a nitrogen stream can be directed to the substrate from the bottom and from the top of the substrate. Accordingly, due to the specific design of the bead removal head, flexibility in bead removal processing is maximized.
    One aspect provides that the at least one fluid outlet is inclined with respect to the respective functional surface. The fluid flow, which is assigned to the at least one fluid outlet, can thus be directed to the receiving space at an incline with respect to the functional surface. The orientation of the fluid flow can thus differ from a vertical orientation. This ensures that a negative pressure or a vacuum can easily occur on the top of the substrate, even if the fluid flow comes from the functional surface that faces the underside of the substrate. Strictly speaking, the respective fluid flows along the edge, so that the material is drawn at the edge of the upper side of the substrate.
    In addition, the main body can have a drain opening which is assigned to the receiving space, the drain opening being connected to a vacuum source. Material or particles that can occur during the edge bead removal process can thus be sucked in by the vacuum to which the drain opening is connected. This ensures that any contaminants are effectively removed from the chamber so that the coating on the substrate, namely the photoresist material applied to the substrate, is not damaged or contaminated.
    In addition, the edge bead removal head can have an edge sensor that is designed to detect the edge of the substrate to be treated. Accordingly, it is ensured that the distance between the at least one fluid outlet and the edge of the substrate is kept stable during the treatment process. For this purpose, the edge sensor can be connected to a control unit of the edge bead removal system, so that the relative position of the edge bead removal head is controlled accordingly
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    -5A 50814/2019 can, which ensures that the distance to the edge is constant during the bead removal process. Strictly speaking, the edge sensor is designed to detect the relative horizontal distance between the edge of the substrate and the at least one fluid outlet.
    In addition, a sensor can be provided which is designed to measure the vertical distance between the functional surface and a corresponding side of the substrate, e.g. the top of the substrate or the bottom of the substrate.
    In addition, the bead removal system can have a linear drive that is connected to the bead removal head. The bead removal head can thus be driven accordingly to ensure that the (relative horizontal) distance remains constant. The linear drive can e.g. ensure that the bead removal head can be moved radially along the edge of the round substrate. In other words, the linear drive moves the bead removal head along the circumference of the substrate.
    In addition, one and the same or a different linear drive is designed to control the vertical movement of the bead removal head with respect to the substrate, so that the vertical distance of the functional surface to the respective side of the substrate is adjusted accordingly. The relative vertical distance can thus be kept constant during the bead removal process.
    According to a further aspect, the edge bead removal system has an edge bead removal piece with a processing surface for holding the substrate to be treated. The processing surface has a diameter of up to 280 mm, for example. The edge bead removal process can strictly speaking take place in an external module with respect to the coating module in which the photoresist material is applied to the top of the substrate. It is thus possible to use a large bead removal chuck that differs from a machining chuck within the coating module. The respective edge bead removal chuck ensures that large substrates or large wafers can be substantially flattened over their entire diameter. Strictly speaking, this ensures that the bead removal system is less dependent on curvature of the substrate because the bead removal die has a diameter that matches the diameter of the (large) substrate. In other words, the dependency between the curvature and the bead removal accuracy is greatly reduced.
    The working surface of the bead removal jewelry can generally be connected to a vacuum source. The substrate can therefore on the applied vacuum
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    Edge bead removal jewelry arranged, in particular centered. The vacuum applied also ensures that the substrate is correspondingly flattened on the processing surface.
    In addition, the bead removal head may have a distance adjusting unit configured to adjust the distance between the arms so that the volume of the receiving space is adjustable. Accordingly, at least one arm of the arms protruding from the main body can be displaced with respect to the other arm along the main body, so that the distance between the two arms can be set in a desired manner. This ensures that substrates with different thicknesses can be processed by one and the same bead removal system, in particular by one and the same bead removal head.
    Another aspect provides that the bead removal system is configured to move the bead removal head in a horizontal direction in order to keep the horizontal distance of the at least one fluid outlet with respect to the edge of the substrate constant. During the treatment of the substrate, namely during the corresponding bead removal process, the bead removal head is moved in the horizontal direction so that the relative horizontal distance between the at least one fluid outlet and the edge of the substrate is kept constant. The linear drive is controlled accordingly for this purpose. The bead removal head is strictly driven by the linear drive along the circumference of the substrate.
    In addition, the edge sensor detects the edge of the substrate to be treated and forwards the respective information, so that the linear drive is controlled in response to the information retrieved from the edge sensor. The relative horizontal position of the at least one fluid outlet with respect to the rim is measured by the rim sensor, the linear drive moving the bead removal head so that the horizontal distance is kept constant.
    Strictly speaking, the components of the edge bead removal system, namely the edge sensor, the linear drive and / or the control unit, ensure that the (horizontal) distance of the at least one fluid outlet with respect to the edge of the substrate is kept constant during the treatment of the substrate. Accordingly, the bead removal system is designed to keep the (relative) horizontal distance constant.
    The functional surfaces of the bead removal head generally extend in the horizontal direction.
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    The processing area of the bead removal jewelry also extends in the horizontal direction.
    The surface of the substrate to which the photoresist material is applied extends essentially in the horizontal direction.
    The arms of the bead removing head are spaced apart in a vertical direction that is substantially perpendicular to the horizontal direction.
    The invention further provides a method for treating a substrate, which comprises the following steps:
    Providing an edge bead removal system, in particular the edge bead removal system described above, which has an edge bead removal head which provides a receiving space between two arms of the edge bead removal head,
    Providing a substrate to be treated and
    Arranging the bead removing head and the substrate such that the substrate is housed in the accommodating space between the arms of the bead removing head.
    This ensures that both the top and the bottom of the substrate can be easily treated by the bead removal system. In particular, both sides or surfaces of the substrate can be treated simultaneously. In addition, the advantages mentioned above apply similarly to the method for treating the substrate.
    The edge bead removal substrate treating method and bead removal system are generally applied to a flattened substrate or wafer. This can be ensured with the specific bead removal chuck that is only used for bead removal with the bead removal system.
    The accuracy of the edge bead removal system depends in particular mainly on the accuracy of the edge sensor and / or on the accuracy of the linear drive. Thus, other effects that affect the accuracy of a disposal system known from the prior art have no effect.
    The bead removal system is strictly no longer dependent on the type of wafer. The recording room is especially large enough to accommodate various
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    Types of wafers. In the case of a very large or very small wafer, the volume of the receiving space can be adjusted accordingly.
    The bead removal system is generally efficient because the volume of the fluid used for bead removal is minimized due to the compact design of the bead removal system, namely due to the minimized distance of the fluid outlets from the substrate.
    DESCRIPTION OF THE DRAWINGS
    The foregoing aspects and many of the associated advantages of the claimed subject matter are readily understood when better understood with reference to the following detailed description when considered in conjunction with the accompanying drawings. In it show:
    FIG. 1 schematically shows a cross-sectional view of part of an edge bead removal system according to the invention; and
    FIG. 2 schematically shows a flow diagram which illustrates a method according to the invention for treating a substrate.
    1 shows a bead removal system 10 for treating a substrate 12.
    The edge bead removal system 10 comprises a chamber 14, in which a edge bead removal piece 16 is arranged, which has a processing surface 18 on which the substrate 12 is arranged for treatment by the edge bead removal system 10.
    In addition, the bead removal system 10 includes a bead removal head 20 that is also disposed within the chamber 14. The bead removal head 20 includes a main body 22 and two arms 24 that protrude from the main body 22. The arms 24 are spaced apart in the vertical direction V, which is perpendicular to a horizontal direction H.
    The vertical direction V and the horizontal direction H are illustrated in a separate illustration, which is shown in FIG. 1.
    The edge bead removal head 20 is strictly C-shaped in a side view, as shown in FIG. 1, since the arms 24 are spaced apart from one another, so that a receiving space 26 is defined in which the substrate to be treated is partially accommodated.
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    As shown in FIG. 1, the substrate 12 has an upper side 28 which is coated with a photoresist material 30, while an underside 32 of the substrate 12 is not coated with the photoresist material. The substrate 12 is arranged on its underside 32 on the edge bead removal chuck 16, in particular on its processing surface 18.
    The edge bead removal chuck 16 is connected to a vacuum source, which generates a negative pressure, so that the substrate 12 is sucked onto its processing surface 18, which ensures that the substrate 12 is flattened accordingly. Numerous vacuum outlets 34 are assigned to the processing surface 18, via which the substrate 12, in particular its underside 12, is sucked in by the vacuum.
    In addition, the edge bead removal jewelry 16 differs from conventional machining jewelry used in coating modules because the edge bead removal jewelry 16, in particular its processing surface 18, has a diameter of up to 280 mm. The substrate 12 can thus have a diameter of up to 300 mm, so that the substrate 12 overlaps radially over a distance d, which is 10 mm as indicated in FIG. 1, with the edge bead removal chuck 16.
    Typically, the substrate 12 is coated on its upper side 28, which is also referred to as the upper surface, with the photoresist material 30, so that an edge bead can occur due to the spin coating used to apply the photoresist material to the upper side 28 of the substrate 12. This edge bead usually occurs in the outer 10 mm of the substrate 12, which is accommodated in the receiving space 26 of the edge bead removal head 20.
    As shown in FIG. 1, both arms 24 each have a functional surface 36 which face each other and towards the substrate 12 accommodated in the receiving space 26.
    Strictly speaking, the first arm 24 has a functional surface 36 which faces the upper side 28 of the substrate 12, while the second arm 24 has a functional surface 36 which faces the lower side 32 of the substrate 12.
    In the embodiment shown, both functional surfaces 36 each have two fluid outlets 38, which are referred to as fluid openings. The first fluid outlet 40 of each functional surface 36 is assigned to a nitrogen line 42 which is embedded in the bead removal head 20, while the second fluid outlet 44 is assigned to a solvent line 46 which is also embedded in the bead removal head 20.
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    The nitrogen line 42 is led out of the chamber 14 for connection to a nitrogen source 48. The solvent line 46 is similarly led out of the chamber 14 for connection to a solvent source 50.
    The fluid outlets 38 can generally be inclined with respect to the respective functional surface 36, so that the fluid flow originating from the respective fluid outlet 38 is inclined with respect to the functional surface 36 and the fluid flow is directed inclined to the receiving space 26 or to the substrate 12.
    This ensures that the respective fluid flow does not impair the properties of the substrate 12, in particular of the photoresist material 30 applied in front of it.
    The fluid stream that originates from the fluid outlet 38 that faces the top 28 of the substrate 12 can, strictly speaking, only scrape along the photoresist material 30 that is deposited on the substrate 12.
    In contrast, the fluid flow that originates from the fluid outlet 38 that faces the bottom 32 of the substrate 12 can be directed so that a negative pressure or vacuum creates on the top 28 of the substrate 12 and the excess photoresist material 30 one existing edge bead or the excess photoresist material 30, which can form the edge bead, is eliminated.
    The fluid streams that originate from the fluid outlets 38 can generally release or release particles that can disrupt or impair the properties of the substrate 12, in particular the photoresist material 30 applied thereon. The solvent flow provided by the fluid outlets 38 connected to the solvent line 46 allows e.g. Solvent in the chamber 14.
    Accordingly, the bead removal head 20, in particular its main body 22, has a drain opening 52 which is assigned to the receiving space 26, the drain opening 52 being connected to a vacuum source 54.
    The contaminants or particles that can occur during the edge bead removal process are thus sucked out of the receiving space 26 via the discharge opening 52, which is assigned to the edge of the substrate 12 as shown in FIG.
    This ensures that the photoresist material 30 applied to the substrate 12 is not contaminated or impaired with particles or solvent. As already mentioned, the photoresist material 30 is not affected by the nitrogen that is emitted from the fluid outlets 38 connected to the nitrogen line 42, since the chamber 14 can be flooded with nitrogen.
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    The respective fluid outlets 38, namely those which are assigned to the nitrogen line 42 or the solvent line 46, can generally at least one nozzle, a channel-like shape, an outflow slot, a brush-like shape, a so-called air lamella (which releases solvents or nitrogen) or the like include. Strictly speaking, the speed of the fluid flow and its shape can be changed by the respective configuration of the fluid outlets 38.
    In addition, the bead removal head 20 has an edge sensor 56, which is designed to detect the edge of the substrate 12 to be treated. The horizontal position of the edge of the substrate 12 (with respect to the bead removing head 20 or a component thereof) is detected by the edge sensor 56.
    In addition, the bead removal system 10 has a linear drive 58 connected to the bead removal head 20 so that the bead removal head 20 can be driven by the linear drive 58 to maintain the distance to the substrate 12 in the desired manner.
    The linear drive 58 ensures that the fluid outlets 38 of the bead removal head 20 are at the same (relative horizontal) distance from the edge of the substrate 12.
    For this purpose, the bead removal head 20 is driven accordingly along the circumference of the substrate 12.
    The respective movement of the bead removal head 20 is indicated by the arrow 59, which illustrates the horizontal direction of movement. The horizontal direction of movement, namely arrow 59, thus runs parallel to the horizontal direction H.
    The edge sensor 56 and the linear drive 58 strictly ensure that the (horizontal) distance of the fluid outlets 38 with respect to the edge of the substrate 12 is kept constant.
    The relative horizontal position of the fluid outlets 38 with respect to the edge is measured by the edge sensor 56, with the linear drive 58 moving the edge bead removal head 20 so that the horizontal distance is kept constant.
    For this purpose, the edge sensor 56 and the linear drive 58 are connected to a control unit 60, which receives the respective data from the edge sensor 56 and controls the linear drive 58 accordingly.
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    The bead removal system 10 is thus designed to move the bead removal head 20 in the horizontal direction so that the horizontal distance of the fluid outlets 38 with respect to the edge of the substrate 12 is kept constant.
    The relative vertical position can also be controlled accordingly. One and the same linear drive 58 or another linear drive can thus drive the bead removal head 20 in such a way that the vertical distance between the functional surface 36 and the substrate 12, in particular a corresponding surface of the substrate 12, is kept constant.
    The control unit 60 can also control the bead removal chuck 16, in particular its rotational speed during the bead removal process. The rate of rotation may generally be slow due to the minimal distance between the fluid outlets 38 and the substrate 12. Accordingly, the bead remover chuck 16 can be provided inexpensively because, because the required rotational speeds are low, an inexpensive motor for the bead remover chuck 16 can be used. The cleaning efficiency is further improved by the low rotation speed.
    The control unit 60 can also control the nitrogen line 42 or the nitrogen source 48 and the solvent line 46 or the solvent source 50.
    Similarly, the control unit 60 is configured to control the vacuum provided on the bead removal tool 16 to position and level the substrate 12 disposed on the processing surface 18 of the bead removal tool 16.
    The control unit 60 can also control the vacuum source 54 assigned to the drain opening 52 in such a way that contaminants or particles which can occur during the edge bead removal process are sucked in.
    The arms 24 may generally be spaced apart from one another such that the receiving space 26 provided is large enough to accommodate many different types of substrates 12.
    However, a distance setting unit 62 can be provided, which ensures that the (vertical) distance between the two arms 24 can be set such that the volume of the receiving space 26 is adjusted in relation to the substrate 12 to be treated. In other words, the distance setting unit 62 is designed to set the vertical distance between the two arms 24 by adjusting the vertical distance of at least one arm 24 with respect to the other arm 24. This is shown schematically in FIG
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    -13- A 50814/2019 shows the lower arm 24, which can be moved along the arrow 63 in the vertical direction V with respect to the other arm 24.
    Accordingly, depending on the size, in particular the thickness of the substrate 12, the volume can be reduced or increased. In the embodiment shown, the substrate 12 has a thickness of typically 775 μm. However, this thickness can vary depending on the type of substrate.
    Furthermore, the chamber 14, in which at least the edge bead removal chuck 16 and the edge bead removal head 10 are accommodated, can differ from the coating chamber of the coating module in which the substrate 12 is coated with the photoresist material 30.
    The edge bead removal system 10 is generally very compact due to the compact design of the edge bead removal head 20, in which the substrate 12, in particular the edge of the substrate 12, are accommodated.
    The substrate 12 is generally treated by providing the bead removal system 10 (step S1).
    In addition, the substrate 12 to be treated is also provided (step S2).
    The substrate 12 and the edge bead removal head 20 are then arranged such that the substrate 12 is accommodated with its edge in the receiving space 26 provided by the edge bead removal head 20 (step S3).
    The edge sensor 56 detects the edge of the substrate 12 to provide data for properly aligning the bead removal head 20 (step S4).
    For this purpose, the control unit 60 controls the linear drive 58 such that the bead removal head 20 is aligned with the substrate 12 in the intended manner (step S5).
    Once the bead removal head 20 and the substrate 12 are aligned, the control unit 60 can control the bead removal chuck 16 to rotate (step S6).
    In addition, the control unit 60 can control the nitrogen source 48 and / or the solvent source 50 in such a way that it provides nitrogen or solvent for the appropriate treatment of the substrate 12, so that excess photoresist material 30 is removed (step S7). In this way, an edge bead that arises can be prevented or an already existing edge bead can be eliminated.
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    The edge bead removal system 10 and the method for treating the substrate 12 strictly ensure that the edge bead removal processes are independent of bulges of the substrate 12, since it is possible to use a separately formed edge bead removal piece 16 with a diameter adapted to the substrate 12. This separately designed edge bead removal chuck 16 is used with respect to the coating module in another module, namely in an edge bead removal module or in the edge bead removal system 10.
    权利要求:
    Claims (13)
    [1]
    Claims
    Edge bead removal system (10) for treating a substrate (12), which comprises an edge bead removal head (20) with a main body (22) and two arms (24) protruding from the main body (22), the arms (24) being spaced apart and between them define a receiving space (26) for accommodating a substrate (12) to be treated, the arms (24) each having a functional surface (36) facing each other, and the functional surfaces (36) each having at least one fluid outlet ( 38).
    [2]
    2. bead removal system (10) according to claim 1, wherein the at least one fluid outlet (38) is associated with a nozzle.
    [3]
    3. bead removal system (10) according to claim 1 or 2, wherein the at least one fluid outlet (38) is connected to a nitrogen line (42) which is embedded in the bead removal head (20).
    [4]
    4. bead removal system (10) according to any one of the preceding claims, wherein the at least one fluid outlet (38) is connected to a solvent line (46) which is embedded in the bead removal head (20).
    [5]
    5. bead removal system (10) according to any one of the preceding claims, wherein each functional surface (36) has at least two fluid outlets (38).
    [6]
    6. bead removal system (10) according to any one of the preceding claims, wherein the at least one fluid outlet (38) is inclined with respect to the respective functional surface (36).
    [7]
    7. bead removal system (10) according to any one of the preceding claims, wherein the main body (22) has a drain opening (52) which is associated with the receiving space (26), wherein the drain opening (52) is connected to a vacuum source (54).
    [8]
    8. edge bead removal system (10) according to any one of the preceding claims, wherein the edge bead removal head (20) has an edge sensor (56) which is designed to detect the edge of the substrate (12) to be treated.
    [9]
    9. edge bead removal system (10) according to any one of the preceding claims, wherein the edge bead removal system (10) has a linear drive (58) which is connected to the edge bead removal head (20).
    [10]
    10. edge bead removal system (10) according to any one of the preceding claims, wherein the edge bead removal system (10) an edge bead removal chuck (16) with a
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    Has processing surface (18) for holding the substrate (12) to be treated, the processing surface (18) in particular having a diameter of up to 280 mm.
    [11]
    11. bead removal system (10) according to any one of the preceding claims, wherein the bead removal head (20) has a distance setting unit (62) which is designed to adjust the distance between the arms (24) so that the volume of the receiving space (26) adjustable is.
    [12]
    12. edge bead removal system (10) according to any one of the preceding claims, wherein the edge bead removal system (10) is adapted to move the edge bead removal head (20) in a horizontal direction to the horizontal distance of the at least one fluid outlet (38) with respect to the edge of the Keep substrate (12) constant.
    [13]
    13. A method for treating a substrate (12), comprising the following steps:
    Providing an edge bead removal system (10), in particular the edge bead removal system (10) according to one of the preceding claims, which has an edge bead removal head (20) which provides a receiving space (26) between two arms (24) of the edge bead removal head (20),
    Providing a substrate (12) and to be treated
    Arranging the bead removal head (20) and the substrate (12) such that the substrate (12) is housed in the receiving space (26) between the arms (24) of the bead removal head (20).
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    同族专利:
    公开号 | 公开日
    TW202030775A|2020-08-16|
    JP2020092252A|2020-06-11|
    DE102019125661A1|2020-03-26|
    KR20200035364A|2020-04-03|
    US20200096867A1|2020-03-26|
    CN110941152A|2020-03-31|
    AT521734A3|2021-11-15|
    NL2021701B1|2020-05-07|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    NL2021701A|NL2021701B1|2018-09-25|2018-09-25|Edge bead removal system and method of treating a substrate|
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